Advanced Metallization Conference 2008 (AMC 2008): Volume 24

by Naik, Mehul
5 out of 5 Customer Rating
ISBN: 9781605111254
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Overview

The Advanced Metallization Conference - held in San Diego, California, and Tokyo, Japan - marked its 25th anniversary in 2008. These two sister conferences form a unique 'one conference at two sites' that focuses on the latest R&D and manufacturing results, as well as real-world integration and reliability data on the application of metallization and related technologies for advanced IC devices. Scientists and engineers from around the world came to listen and present state-of-the-art work in the field of ULSI interconnect technology including metallization, dielectrics, integration, packaging, design and vertical integration. A keynote address by Gary Patton, vice president, IBM Systems and Technology Group, on 'Leading-edge Silicon Technology through Innovation and Collaboration', is featured. Additional topics include: integration; metallization; materials and characterization; CMP and cleaning; 3D integration and packaging; low-k materials; and reliability and yield.
  • Format: Hardcover
  • Author: Naik, Mehul
  • ISBN: 9781605111254
  • Condition: Used
  • Dimensions: 9.10 x 1.70
  • Number Of Pages: 769
  • Publication Year: 2009

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