Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch Smt Assemblies

by Lau, John H.
5 out of 5 Customer Rating
ISBN: 9780070366480
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Overview

  • Format: Hardcover
  • Author: Lau, John H.
  • ISBN: 9780070366480
  • Condition: Used
  • Dimensions: 9.35 x 1.37
  • Number Of Pages: 408
  • Publication Year: 1996

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